DOM >
GLASS

Infrared picosecond double platform glass cutting machine

PROWADZENIE TERAZ
1785x1520x1950mm
The maximum stroke of the platform
Double Y interactive workbench
Workbench
1064nm
Laser band
皮秒切割01.png

Patented Design SolidMachine Bed

Rich human-computer
interface simple operation,easy to use

Picosecond infrared ultrafast laser
Picosecond infrared ultrafast laser
The picosecond cutting machine is a precision cutting machine, which obtains extremely high peak light intensity with low pulse energy and at the same time utilizes the characteristics of low thermal energy diffusion to complete material interruption before heat conduction to surrounding materials without destroying the structure of the material , to achieve high-precision cutting.
Fully automatic asynchronous intelligent loading and unloading structure
Fully automatic asynchronous intelligent loading and unloading structure
Double-platform processing saves loading and unloading time. For materials with relatively simple cutting patterns, the asynchronous loading and unloading structure can double the processing capacity.
High-precision moving parts
High-precision moving parts
Using linear motor and imported digital grating ruler, the machine has high precision.Gantry structure and marble workbench, twice grinding process, high precision and stability.

Born for quality, moving forward with light

International standard, parallel protection and laser
Medium to high power, high energy saving efficiency

皮秒切割01.png

Przeciągnij mnie, aby wyświetlić więcej

  • PRZEGLĄD 3D
  • Oglądaj wideo

Drag Me to View More

"Super fine" to ensure high-precision cutting
CCD pre-scan & automatic target positioning
Secondary grinding process, high precision, strong stability
Ultrashort pulse processing without heat conduction, suitable for high-speed cutting of brittle materials
Drag Me to View More
Ładowanie modelu 3D
/1ca/image/20230419/c388b30f565e08f32cc6a3da8a2bedba.png

Ultra-high-power Laser Cutting Machine

01
Fully enclosed optical path structure to ensure stable light source output during processing
02
Support visual positioning to make processing more efficient
03
Double Y interactive platform, double the efficiency
04
Gantry structure, marble work surface

Partition dust removal system

Different Power, Format for Options
Customized Service can be Offered

Zobacz więcej

Cutting Samples

打标1.png

What users say about us in
various industries

Application industry

Skontaktuj się z nami

Przeczytałem i zgadzam się z polityką prywatności
Infrared picosecond double platform glass cutting machine
PROWADZENIE TERAZ
1785x1520x1950mm
The maximum stroke of the platform
Double Y interactive workbench
Workbench
1064nm
Laser band
皮秒切割01.png
Patented Design SolidMachine Bed
Rich human-computer
interface simple operation,easy to use
Picosecond infrared ultrafast laser
The picosecond cutting machine is a precision cutting machine, which obtains extremely high peak light intensity with low pulse energy and at the same time utilizes the characteristics of low thermal energy diffusion to complete material interruption before heat conduction to surrounding materials without destroying the structure of the material , to achieve high-precision cutting.
Fully automatic asynchronous intelligent loading and unloading structure
Double-platform processing saves loading and unloading time. For materials with relatively simple cutting patterns, the asynchronous loading and unloading structure can double the processing capacity.
High-precision moving parts
Using linear motor and imported digital grating ruler, the machine has high precision.Gantry structure and marble workbench, twice grinding process, high precision and stability.
OPIS PRODUKTU
Born for quality, moving forward with light
International standard, parallel protection and laser
Medium to high power, high energy saving efficiency
皮秒切割01.png
Przeciągnij mnie, aby wyświetlić więcej
Ładowanie modelu 3D
Drag Me to View More

"Super fine" to ensure high-precision cutting

CCD pre-scan & automatic target positioning

Secondary grinding process, high precision, strong stability

Ultrashort pulse processing without heat conduction, suitable for high-speed cutting of brittle materials

皮秒切割01.png
PRZEGLĄD 3D
Oglądaj wideo
Ultra-high-power Laser Cutting Machine
01
Fully enclosed optical path structure to ensure stable light source output during processing
02
Support visual positioning to make processing more efficient
03
Double Y interactive platform, double the efficiency
04
Gantry structure, marble work surface
PARAMETRY PRODUKTU
Partition dust removal system
Zobacz więcej
Different Power, Format for Options
Customized Service can be Offered
PARAMETRY PRODUKTU
Cutting Samples
BADANIA KLIENTÓW
What users say about us in
various industries
ŚWIADCZENIA UŻYTKOWNIKÓW
Application industry
Skontaktuj się z nami
Przeczytałem i zgadzam się z polityką prywatności
Wysyłaj

Zalecane wiadomości

Partition dust removal system

 I hereby consent to XT LASER use the previoulsly entered information to contact me about related product and feature updates, current offers and services. I can unsubscribe from these communications at any time.

For more information on data protection can be found in our Privacy Policy.

Privacy Policy

(Last Updated: March 24, 2020)

This privacy policy describes how we handle your personal information. By using 域名 (the "Site") you consent to the storage, processing, transfer and disclosure of your personal information as described in this privacy policy.

Collection

You may browse this Site without providing any personal information about yourself. However, to receive notifications, updates or request additional information about 域名 or this Site, we may collect the following information:

name, contact information, email address and user ID;

correspondence sent to or from us;

any additional information you choose to provide; and other information from your interaction with our Site, services, content and advertising, including computer and connection information, statistics on page views, traffic to and from the Site, ad data, IP address and standard web log information.

If you choose to provide us with personal information, you consent to the transfer and storage of that information on our servers located in the United States.

Use

We use your personal information to provide you with the services you request, communicate with you, troubleshoot problems, customize your experience, inform you about our services and Site updates and measure interest in our sites and services.

Like many websites, we use "cookies" to enhance your experience and gather information about visitors and visits to our websites. Please refer to the "Do we use 'cookies'?" section below for information about cookies and how we use them.

Disclosure

We don't sell or rent your personal information to third parties for their marketing purposes without your explicit consent. We may disclose personal information to respond to legal requirements, enforce our policies, respond to claims that a posting or other content violates other's rights, or protect anyone's rights, property, or safety. Such information will be disclosed in accordance with applicable laws and regulations. We may also share personal information with service providers who help with our business operations, and with members of our corporate family, who may provide joint content and services and help detect and prevent potentially illegal acts. Should we plan to merge or be acquired by another business entity, we may share personal information with the other and will require that the new combined entity follow this privacy policy with respect to your personal information.

Access

You may access or update the personal information you provided to us at any time by contacting us at 域名

Security

We treat information as an asset that must be protected and use lots of tools to protect your personal information against unauthorized access and disclosure. However, as you probably know, third parties may unlawfully intercept or access transmissions or private communications. Therefore, although we work very hard to protect your privacy, we do not promise, and you should not expect that your personal information or private communications will always remain private.

General

We may update this policy at any time by posting amended terms on this site. All amended terms automatically take effect 30 days after they are initially posted on the site. For questions about this policy, please send email to us.

 

  • {{ words.title }}